LONGi Mono-crystalline Wafer
The mono-crystalline wafer production flow consists of cutting, cleaning and sorting procedures. The production capacity and wafer yield rate have been continuously improved to meet the clients’ requirements on wafer quality and yield with great endeavors to constant improve our cutting technology and final inspection capacity.
LONGi M6 Products With New Specifications
The new specification is highly matched with the existing PERC cell equipment,which is suitable for the development trend of large wafer size as well as higher cost performance.
Wafer Size Development Path
Time
Product name
Size
Increase of area
  • 2013
    M0
    156*156*dia200
    0
  • 2014
    M0 TO M1
    156.75*156.75*dia205
    1.63%
  • 2015
    M0 TO M2
    156.75*156.75*dia210
    2.25%
  • 2019
    M2 TO M6
    166*166*dia223
    12.21%
Thickness Shipment Statistics
Since October 2015, 100% production of LONGi Mono-crystalline wafer had entered cutting with diamond wire. After 2 years of technology research and development, the 110μm wafer technology has been developed. Except mass production of 180μm, 170μm and 160μm, samples of all thicknesses can be made and mass production can be available in 2 months.
Wafer BU

The world’s leading manufacturer of Mono-crystalline silicon wafer

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CONTACT US
Email:
longisilicon@longigroup.com
Tel(International Business):
029-81566579
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