LONGi Mono-crystalline Wafer
The mono-crystalline wafer production flow consists of cutting, cleaning and sorting procedures. The production capacity and wafer yield rate have been continuously improved to meet the clients’ requirements on wafer quality and yield with great endeavors to constant improve our cutting technology and final inspection capacity.
LONGi M2 Products With New Specifications
New specifications can match with the existing conventional 156*156mm cell devices, and thus no large-scale adjustment is needed for the existing production line.
Wafer Size Development Path
Time
Product name
Size
Increase of area
Increase of cost
Increase of modules
Increase of system
  • 2013
    m0
    156*156*dia200
    0
    0
    0
    0
  • 2014
    m0 to m1
    156.75*156.75*dia205
    1.63%
    1 cent/pcs
    5 cent/pcs
    8 cent/pcs
  • 2015
    to M2
    156.75*156.75*dia210
    2.25%
    2cent/pcs
    7cent/pcs
    10cent/pcs
Thickness Shipment Statistics
Since October 2015, 100% production of LONGi Mono-crystalline wafer had entered cutting with diamond wire. After 2 years of technology research and development, the 110μm wafer technology has been developed. Except mass production of 190μm, 180μm and 150μm, samples of all thicknesses can be made and mass production can be available in 2 months.
Monocrystalline silicon

The world’s leading manufacturer of Mono-crystalline silicon wafer

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CONTACT US
Email:
longisilion@longi-silicon.com
Tel(International Business):
029-81566579
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